SiHB25N50E E Series Power MOSFET
技术特性
- Low figure-of-merit (FOM): Ron x Qg
- Low input capacitance (Ciss)
- Reduced switching and conduction losses
Datasheet
General Information
- General Information - Useful Web Links
Pad Guidelines
- PAD Pattern - D2PAK
RC Thermal Models
- SiHB25N50E_RC - R-C Thermal Model Parameters
Reliability Data
- Package Reliability - Environmental and Package Testing Data for D2PAK (TO-263) (HVM)
- Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result
SPICE Models (*.pdf)
- SiHB25N50E-DS - DS-SPICE Model for SiHB25N50E
SPICE Models (*.zip)
- SiHB25N50E-zip - SPICE Models for SiHB25N50E
- SiHB25N50E 91646
- General Information 91155
- PAD Pattern 68668
- SiHB25N50E_RC 91646
- Package Reliability 91302
- Silicon Technology Reliability 63402
- SiHB25N50E-DS 91646
- SiHB25N50E-zip 91646
