SiHD3N50D D Series Power MOSFET
Features
- Optimal design
- Low area specific on-resistance
- Low input capacitance (Ciss)
Datasheet
General Information
- General Information - Useful Web Links
Package Drawings
- Package Information - TO-252AA Case Outline
Pad Guidelines
- Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
RC Thermal Models
- SiHD_U3N50D_RC - R-C Thermal Model Parameters
Reliability Data
- Package Reliability - Environmental and Package Testing Data for DPAK (TO-252), IPAK (HVM)
- Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result
Tape Info
- 90-2339-1 - Tape Drawing for TO-252 (DPAK) (T1 Method)
- 90-2369-x - Tape Drawing for TO-252 (DPAK) (T4 Method)
- Device Orientation - Device Orientation for TO-252 and TO-263 (T5)
- SiHD3N50D 91495
- General Information 91155
- Package Information 62897
- Application Note 826 62897
- SiHD_U3N50D_RC 91495
- Package Reliability 91273
- Silicon Technology Reliability 63402
- 90-2339-1 62897
- 90-2369-x 69098
- Device Orientation 91477
- SiHD3N50D D Series Power MOSFET 91495
