ADL5542 20 MHz to 6 GHz RF/IF Gain Block, Fixed Gain of 20 dB

The ADL5542 is a broadband 20 dB linear amplifier that operates at frequencies up to 6 GHz. The device can be used in a wide variety of CATV, cellular, and instrumentation equipment.

The ADL5542 provides a gain of 20 dB that is stable over frequency, temperature, power supply, and from device to device. The device is internally matched to 50 Ω with an input return loss of 10 dB or better, up to 6 GHz. Only input/output ac coupling capacitors, power supply decoupling capacitors, and an external inductor are required for operation.

The ADL5542 is fabricated on an InGaP HBT process and has an ESD rating of 1 kV (Class 1C). The device is packaged in a 3 mm × 3 mm LFCSP that uses an exposed paddle for excellent thermal impedance.

The ADL5542 consumes 93 mA on a single 5 V supply and is fully specified for operation from −40°C to +85°C.

A fully populated RoHS-compliant evaluation board is available.

The ADL5541 is a companion part that offers a gain of 15 dB in a pin-compatible package.

Features and Benefits
  • Fixed gain of 20 dB
  • Operation up to 6 GHz
  • Input/output internally matched to 50 Ω
  • Integrated bias control circuit
  • Output IP3
    46 dBm at 500 MHz
    40 dBm at 900 MHz
  • Output 1 dB compression: 20.6 dB at 900 MHz
  • Noise figure of 3 dB at 900 MHz
  • Single 5 V power supply
  • Small footprint 8-lead LFCSP
  • Pin compatible with 15 dB gain ADL5541
  • 1 kV ESD (Class 1C)
  • RF & Microwave
    S-Parameters
    Design Tools
    Data Sheets
    Documentnote
    ADL5542: 20 MHz to 6 GHz RF/IF Gain Block Data Sheet (Rev. C)PDF 262.19 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 133.7 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 439 kB
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    ADL5542ACPZ-R7 Production8 ld LFCSP (3x3mm 1.74x1.45mm EP)REEL 1500-40 to 85C01.55Y
    Evaluation Boards
    Part NumberDescriptionPriceRoHS
    ADL5542-EVALZEvaluation Board100.19Y
    Reference Materials
    ADL5542: 20 MHz to 6 GHz RF/IF Gain Block Data Sheet (Rev. C) adl5542
    ADL5542:50 MHz至6 GHz RF/IF增益模块 (Rev B, 12/2013) ADL5542
    ADL5542 S-Parameters adl5542
    ADI RF Amplifier Library for Agilent ADS ad8353
    ADL5542:50 MHz至6 GHz RF/IF增益模块 (Rev. B) adl5542
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    AN-1389: 引线框芯片级封装(LFCSP)的建议返修程序 (Rev. 0) ad9540
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    AN-772: 引脚架构芯片级封装(LFCSP)设计与制造指南 (Rev. 0) ad9540
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856
    RF Source Booklet adf9010