HMC-APH633-DIE Medium Power Amplifier Chip, 71 - 76 GHz
The HMC-APH633 is a two stage GaAs HEMT MMIC Medium Power Amplifier which operates between 71 and 76 GHz. The HMC-APH633 provides 13 dB of gain, and an output power of +20 dBm at 1 dB compression from a +4V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.
The HMC-APH633 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
Applications
- Short Haul / High Capacity Links
- Wireless LAN Bridges
- Military & Space
- E-Band Communication Systems
Features and BenefitsGain: 13 dBP1dB: +20 dBmSupply Voltage: +4V50 Ohm Matched Input/OutputDie Size:
2.47 x 1.60 x 0.05 mm | S-Parameters |
Data Sheets
Application Notes
Order Information
| Part Number | Package | Packing Qty | Temp Range | Price 100-499 | Price 1000+ | RoHS |
|---|
| HMC-APH633 Production | CHIPS OR DIE | OTH 10 | 25C | 140.07 | 108.9 | Y |
Reference Materials
