HMC-AUH318-DIE Medium Power Amplifier Chip, 71 - 76 GHz
The HMC-AUH318 is a high dynamic range, three stage GaAs HEMT MMIC Medium Power Amplifier which operates between 71 and 76 GHz. The HMCAUH318 provides 24 dB of gain, and an output power of +17.5 dBm at 1 dB compression from a +4V supply voltage. All bond pads and the die backside are Ti/Au metallized. The HMC-AUH318 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
Applications
- Short Haul / High Capacity Links
- Test & Measurement Equipment
- E-Band Communication Systems
Features and BenefitsGain: 24 dBP1dB: +17.5 dBmSupply Voltage: +4V50 Ohm Matched Input/OutputDie Size:
2.65 x 1.60 x 0.05 mm | |
Data Sheets
Application Notes
Order Information
| Part Number | Package | Packing Qty | Temp Range | Price 100-499 | Price 1000+ | RoHS |
|---|
| HMC-AUH318 Production | CHIPS OR DIE | OTH 10 | 25C | 121.28 | 80.3 | Y |
| HMC-AUH318-SX Production | CHIPS OR DIE | REEL 2 | 25C | 0 | 0 | Y |
Reference Materials
