The HMC-XTB110 is a monolithic x3 Passive Frequency Multiplier which utilizes GaAs Shottky Diode technology, and exhibits low conversion loss and high Fo isolation. This wideband x3 multiplier requires no DC power, and is targeted to high volume applications where frequency x3 of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized. The HMC-XTB110 Passive x3 MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
E-Band Communication Systems
Short-Haul / High Capacity Radios
Automotive Radar
Test & Measurement Equipment
SATCOM
Features and Benefits
| RF & Microwave |
| Document | note |
| HMC-XTB110 Data Sheet | PDF 535.13 K |
| Part Number | Package | Packing Qty | Temp Range | Price 100-499 | Price 1000+ | RoHS |
|---|---|---|---|---|---|---|
| HMC-XTB110 Production | CHIPS OR DIE | OTH 50 | -55 to 85C | 45.71 | 37.03 | Y |
| HMC-XTB110-SX Production | CHIPS OR DIE | OTH 2 | -55 to 85C | 0 | 0 | Y |
