HMC204 / HMC204C8 / HMC204MS8G Passive frequency doubler chip and surface mount technology (SMT), 4 GHz to 8 GHz input

The HMC204 devices are passive miniature frequency doublers that are available in a monolithic microwave integrated circuit (MMIC) die (HMC204), a nonhermetic surface mount package, and an 8-lead MSOP surface mount package. Suppression of undesired fundamental and higher order harmonics range from 38 dB to 42 dB typical with respect to input signal level. The doublers utilize the same GaAs Schottky diode/balun technology found in Hittite MMIC mixers. They feature small size, no dc bias, and no measurable additive phase noise onto the multiplied signal.

Applications

Features and Benefits
  • Conversion loss
    HMC204: 17 dB
    HMC204C8: 16 dB
    HMC204MS8G/HMC204MS8GE: 17 dB
  • FO, 3FO, 4FO isolation
    HMC204: 38 dB
    HMC204C8: 40 dB
    HMC204MS8G/HMC204MS8GE: 42 dB
  • Passive: no bias required
  • Available in an ultra small package: MSOP-8
RF & Microwave
S-Parameters
Data Sheets
Documentnote
HMC204C8 Data SheetPDF 529.7 K
HMC204MS8G Data SheetPDF 494.7 K
HMC204 Die Data SheetPDF 529.47 K
Order Information
Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
HMC204 Last Time BuyCHIPS OR DIEREEL 50-55 to 85C17.8614.76Y
HMC204C8 Last Time Buy8 ld SMT (4.32x5.59)OTH 50-55 to 85C48.1639.01Y
HMC204C8TR Last Time Buy8 ld SMT (4.32x5.59)REEL 100-55 to 85C48.1639.01Y
HMC204MS8G Last Time Buy8 ld MSOP_EPOTH 50-55 to 85C10.238.29N
HMC204MS8GE Last Time Buy8 ld MSOP_EPOTH 50-55 to 85C8.837.18Y
HMC204MS8GETR Last Time Buy8 ld MSOP_EPREEL 500-55 to 85C8.837.18Y
HMC204MS8GTR Last Time Buy8 ld MSOP_EPREEL 500-55 to 85C10.238.29N
Reference Materials
HMC204C8 Data Sheet hmc204
HMC204MS8G Data Sheet hmc204
HMC204 Die Data Sheet hmc204
HMC204C8 S-Parameters hmc204
HMC204MS8G S-Parameters hmc204
HMC204 Die S-Parameters hmc204
Package/Assembly Qualification Test Report: MS8G (QTR: 2014-00393) hmc536ms8g
Semiconductor Qualification Test Report: MESFET-B (QTR: 2013-00245) hmc798
PCN: MS, QS, SOT, SOIC packages - Sn/Pb plating vendor change hmc536ms8g
HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of... hmc536ms8g
8 Lead Ceramic Package Type Specification (C8) hmc347
MSOP 8 & 10 Tape Specification (MS8, MS8G, MS10, MS10G) hmc349ams8g