HMC327 MMIC Power Amplifier SMT, 3 - 4 GHz

The HMC327MS8G(E) is a high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC Power amplifier which operates between 3 and 4 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance. With a minimum of external components, the amplifier provides 21 dB of gain, +30 dBm of saturated power at 45% PAE from a +5V supply voltage. Power down capability is available to conserve current consumption when the amplifier is not in use.

Applications
  • Wireless Local Loop
Features and Benefits
  • Gain: 21 dB
  • Saturated Power: +30 dBm
  • 45% PAE
  • Supply Voltage: +5V
  • Power Down Capability
  • Low External Part Count
  • Amplifiers
    S-Parameters
    Data Sheets
    Documentnote
    HMC327 Data SheetPDF 570.03 K
    Application Notes
    Documentnote
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    HMC327MS8G Last Time Buy8 ld MSOP_EPOTH 50-40 to 85C12.4110.05N
    HMC327MS8GE Production8 ld MSOP_EPOTH 50-40 to 85C9.367.66Y
    HMC327MS8GETR Production8 ld MSOP_EPREEL 500-40 to 85C9.367.66Y
    HMC327MS8GTR Last Time Buy8 ld MSOP_EPREEL 500-40 to 85C12.4110.05N
    Evaluation Boards
    Part NumberDescriptionPriceRoHS
    104991-HMC327MS8GEvaluation Board - HMC327MS8G Evaluation PCB339.64Y
    Reference Materials
    Datasheet
    HMC327 Data Sheet hmc327
    Other
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    HMC327 S-Parameter hmc327
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of... hmc536ms8g
    PCN: MS, QS, SOT, SOIC packages - Sn/Pb plating vendor change hmc536ms8g
    Semiconductor Qualification Test Report: GaAs HBT-B (QTR: 2013-00229) hmc311sc70
    Package/Assembly Qualification Test Report: MS8G (QTR: 2014-00393) hmc536ms8g
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    MSOP 8 & 10 Tape Specification (MS8, MS8G, MS10, MS10G) hmc349ams8g