HMC460-Die Wideband Low Noise Amplifier Chip, DC - 20 GHz

The HMC460 is a GaAs MMIC PHEMT Low Noise Distributed Amplifier die which operates between DC and 20 GHz. The amplifier provides 14 dB of gain, 2.5 dB noise figure and +16 dBm of output power at 1 dB gain compression while requiring only 60 mA from a +8V supply. The HMC460 amplifier can easily be integrated into Multi-Chip-Modules (MCMs) due to its small size. All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).

Applications
  • Telecom Infrastructure
  • Microwave Radio & VSAT
  • Military & Space
  • Test Instrumentation
Features and Benefits
  • Noise Figure: 2.5 dB @ 10 GHz
  • Gain: 14 dB @ 10 GHz
  • P1dB Output Power: +16 dBm @ 10 GHz
  • Supply Voltage: +8V @ 60 mA
  • 50 Ohm Matched Input/Output
  • Die Size: 3.12 x 1.63 x 0.1 mm
  • RF & Microwave
    S-Parameters
    Data Sheets
    Documentnote
    HMC460 Die Data SheetPDF 726.41 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    HMC460 ProductionCHIPS OR DIEOTH 25-55 to 85C87.7373.89Y
    HMC460-SX ProductionCHIPS OR DIEOTH 2-55 to 85C00Y
    Reference Materials
    HMC460 Die Data Sheet hmc460-die
    HMC460 Die S-Parameters hmc460-die
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    Semiconductor Qualification Test Report: PHEMT-F (QTR: 2013-00269) hmc383lc4