HMC562-DIE Wideband Driver Amplifier Chip, 2 - 35 GHz

The HMC562 is a GaAs MMIC PHEMT Distributed Driver Amplifier die which operates between 2 and 35 GHz. The amplifier provides 12.5 dB of gain, +27 dBm output IP3 and +12 dBm of output power at 1 dB gain compression while requiring 80 mA from a +8V supply. The HMC562 is ideal for EW, ECM and radar driver amplifier applications. The HMC562 amplifier I/O’s are DC blocked and internally matched to 50 Ohms facilitating integration into Multi-Chip-Modules (MCMs). All data is taken with the chip connected via two 0.075mm (3 mil) ribbon bonds of minimal length 0.31mm (12 mils).

Applications

Features and Benefits
  • P1dB Output Power: +12 dBm
  • Gain: 12.5 dB
  • Output IP3: +19 dBm
  • Supply Voltage: +8V @ 80 mA
  • 50 Ohm Matched Input/Output
  • Die Size: 3.12 x 1.42 x 0.1 mm
    • Amplifiers
    S-Parameters
    Data Sheets
    Documentnote
    HMC562 Data SheetPDF 638.15 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    HMC562 ProductionCHIPS OR DIEOTH 10-55 to 85C223.13180.73Y
    HMC562-SX ProductionCHIPS OR DIEOTH 200Y
    Reference Materials
    Datasheet
    HMC562 Data Sheet hmc562-die
    Other
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    HMC562 S-Parameter hmc562-die
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Semiconductor Qualification Test Report: PHEMT-F (QTR: 2013-00269) hmc383lc4
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
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