HLMT-PL00 Subminiature High Performance AlInGaP LED Lamps

Flat Top Package The HLMT-PL00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more infor-mation refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps datasheet. Technology These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting condi-tions.

Features
  • Subminiature Flat Top Package
  • Ideal for Backlighting and Light Piping Applications
  • Wide Range of Drive Currents
  • Color: 590 nm Amber
  • Ideal for Space Limited Applications
  • Axial Leads
  • Available with Lead Configurations for Surface Mount and Through Hole PC Board Mounting
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Samples AvailableYes
ColorAmber
Color Bin SelectionOpen
Dimension Lxwxh In Mm2.2 x 2.1 x 2.2
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeTS-AlInGaP
Max Qty of Samples20
Minimum Luminous Intensity (mcd)40.0
Number Of ColorsSingle
PackageFlat Top Subminiature
Test Current (mA)20.0
Typical Dominant Wavelength (nm)590
Typical Luminous Intensity (mcd)150
Viewing Angle (degree)125°
Application Brief (5)
Application Note (4)
Data Sheet (2)
Product Change Notice (PCN) (2)
Reliability Data Sheet (1)