HMPP-3895 MiniPak PIN switch diode _ BDTIC a Leading Distributor in China

HMPP-3895 MiniPak PIN switch diode

The HMPP-3895 / HMPP-389x series is optimized for pin diode switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.

Features

VBR=50 V
Ct=0.30 pF
Rs@5mA=2.5 ohms
Tau= 200 nSec

Specification	Value
Lifecycle	Active
Samples Available	Yes
Bkdwn Vo In V	50.0
Carrier Life In Nsec (ns)	200
Connection	Parallel
RoHS6 Compliant	Y
Max Cap In Pf	0.3
Distrib. Inventory	Yes
Max Qty of Samples	25
Peak Output Current Min Uom	MSL 28
Mounting Direction	Top
Mounting Method	Solder Reflow
Pin Count	4.0
Product Type	Low Resistance Switch
Lifetime Ns	200.0
Ct (pF)	0.2
RS (ohm)	2.5
VBR (V)	100
Vbr V	100.0
Ct Pf	0.2
Series Res In Ohms	2.5
Configuration	Parallel
Package	Minipak

Application Brief (1)

Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (11)

AN 9571: Broading the Shunt PIN Diode SPDT Switch.pdf（08/16/2010）
AN 1312: Evaluating the HMPP-3860, HMPP-3890 PIN Switches on the RW053B Demoboard.pdf（08/14/2010）
AN 9572: Reducing the Insertion Loss a Shunt PIN Diode.pdf（08/14/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1049: A Distortion PIN Diode Switch Surface Mount Devices.pdf（08/13/2010）
AN 1072: Applications for the HSMP3890 Surface Mount Switching PIN Diode.pdf（08/13/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 1048: Cost Surface Mount PIN Diode Pi Attenuator.pdf（07/13/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）

Data Sheet (1)

HMPP-389x, MiniPak Surface Mount RF PIN Switch Diodes.pdf（08/05/2009）

Product Change Notice (PCN) (9)

V13-004-480035-0A - Change of platform and Alternative second source for testing Quad Flat.pdf（03/12/2013）
V12-009-480036-0A - Change in cover tape material.pdf（04/25/2012）
V08-019-480036-0A.pdf（12/11/2008）
A06-003-480035-0A, Nov.2005.pdf（12/21/2005）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A04-013-480035-0A, Dec. 2004.pdf（12/17/2004）
PCN: A04-002-480035-0A, Apr. 2004.pdf（04/07/2004）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）

Reliability Data Sheet (1)

HMPP-386x/HMPP-389x, Series MiniPak PIN Diode.pdf（02/12/2008）

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