• 简体中文
• English

HMPP-389T MiniPak PIN switch diode

The HMPP-389T / HMPP-389x pin diode series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded pin diodes, and lower thermal resistance.

Application Brief (1)

• Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (11)

• HMPP-3890 and HMPP-389T - 2.4 GHz Series Shunt TR Switch - AN5327.pdf（08/18/2010）
• AN 9571: Broading the Shunt PIN Diode SPDT Switch.pdf（08/16/2010）
• AN 1312: Evaluating the HMPP-3860, HMPP-3890 PIN Switches on the RW053B Demoboard.pdf（08/14/2010）
• AN 9572: Reducing the Insertion Loss a Shunt PIN Diode.pdf（08/14/2010）
• AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
• AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
• AN 1049: A Distortion PIN Diode Switch Surface Mount Devices.pdf（08/13/2010）
• AN 1072: Applications for the HSMP3890 Surface Mount Switching PIN Diode.pdf（08/13/2010）
• AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
• AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
• AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）

Data Sheet (1)

• HMPP-389x, MiniPak Surface Mount RF PIN Switch Diodes.pdf（08/05/2009）

Product Change Notice (PCN) (8)

• V13-004-480035-0A - Change of platform and Alternative second source for testing Quad Flat.pdf（03/12/2013）
• V12-009-480036-0A - Change in cover tape material.pdf（04/25/2012）
• A06-003-480035-0A, Nov.2005.pdf（12/21/2005）
• CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
• CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
• PCN: A04-013-480035-0A, Dec. 2004.pdf（12/17/2004）
• PCN: A04-002-480035-0A, Apr. 2004.pdf（04/07/2004）
• CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）