HSML-C170 Avago Technologies HSML-C170 High Performance ChipLED

This chip-type LED utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available color in this surface mount is 605 nm Orange for AS AlInGaP. This package is binned by both color and intensity. This ChipLED comes in top emitting package with wide viewing angle suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel. This package is compatible with IR soldering process

Features
  • High brightness AlInGaP material
  • Small size
  • Industry standard footprint
  • Diffused optics
  • Compatible with IR soldering
  • Available in 8 mm tape on 7" diameter reel
  • Reel sealed in zip locked moisture barrier bags
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Color Bin SelectionOpen
Dimension Lxwxh In Mm2.0 x 1.25 x 0.8
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeAS-AlInGaP
Lens TypeFlat_top-diffused_non-tinted
Max Qty of Samples20
Minimum Luminous Intensity (mcd)25.0
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsSingle
Operating Temperature Range-30°C to +85°C
PackageTop Mount Low Profile C170 High Brightness
Test Current (mA)20.0
Typical Forward Voltage In V1.9V @ 20mA
Typical Dominant Wavelength (nm)605
Typical Luminous Intensity (mcd)90
Viewing Angle (degree)170
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (5)
Reliability Data Sheet (1)