HSML-C170 Avago Technologies HSML-C170 High Performance ChipLED
This chip-type LED utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available color in this surface mount is 605 nm Orange for AS AlInGaP.
This package is binned by both color and intensity.
This ChipLED comes in top emitting package with wide viewing angle suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel.
This package is compatible with IR soldering process
Features- High brightness AlInGaP material
- Small size
- Industry standard footprint
- Diffused optics
- Compatible with IR soldering
- Available in 8 mm tape on 7" diameter reel
- Reel sealed in zip locked moisture barrier bags
| Specification | Value |
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Lifecycle | Active | Distrib. Inventory | Yes | Color Bin Selection | Open | Dimension Lxwxh In Mm | 2.0 x 1.25 x 0.8 | Intensity Bin Selection | Open | RoHS6 Compliant | Y | Led Chip Type | AS-AlInGaP | Lens Type | Flat_top-diffused_non-tinted | Max Qty of Samples | 20 | Minimum Luminous Intensity (mcd) | 25.0 | Peak Output Current Min Uom | 2a | Mounting Direction | Top | Mounting Method | Surface Mount | Number Of Colors | Single | Operating Temperature Range | -30°C to +85°C | Package | Top Mount Low Profile C170 High Brightness | Test Current (mA) | 20.0 | Typical Forward Voltage In V | 1.9V @ 20mA | Typical Dominant Wavelength (nm) | 605 | Typical Luminous Intensity (mcd) | 90 | Viewing Angle (degree) | 170 |
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Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (5)
Reliability Data Sheet (1)