HSMP-3823 Low resistance PIN switch diode _ BDTIC a Leading Distributor in China

HSMP-3823 Low resistance PIN switch diode

The HSMP-3823 / HSMP-382x family of low resistance PIN diodes are optimized for applications where ultra-low resistance is required.

Features

Ct=0.8pF
Rs@10mA=0.6ohms
Tau=70nSec

Specification	Value
Lifecycle	Active
Samples Available	No
Bkdwn Vo In V	35.0
Carrier Life In Nsec (ns)	70
Connection	Common Anode Pair
RoHS6 Compliant	Y
Max Cap In Pf	0.8
Distrib. Inventory	Yes
Max Qty of Samples	0
Peak Output Current Min Uom	MSL 1
Mounting Direction	Top
Mounting Method	Solder Reflow
Pin Count	3.0
Product Type	Low Inductance Limiter
Lifetime Ns	70.0
Trr Ns	7.0
Ct (pF)	0.8
RS (ohm)	0.6
Trr (nS)	7
VBR (V)	50
Vbr V	50.0
Ct Pf	0.8
Series Res In Ohms	0.6
Configuration	Common Anode
Package	SOT-23

Application Note (10)

AN 9571: Broading the Shunt PIN Diode SPDT Switch.pdf（08/16/2010）
AN 9572: Reducing the Insertion Loss a Shunt PIN Diode.pdf（08/14/2010）
AN 1049: A Distortion PIN Diode Switch Surface Mount Devices.pdf（08/13/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 1050: Cost Surface Mount Power Limiters.pdf（07/13/2010）
AN 1048: Cost Surface Mount PIN Diode Pi Attenuator.pdf（07/13/2010）
AN 922: Applications PIN Diodes.pdf（07/13/2010）
AN 1054: Cost Frequency Multipliers SMT PIN Diodes.pdf（05/06/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）

Data Sheet (1)

HSMP-382x, HSMP-482x, Surface Mount RF PIN Switch Limiter Diodes.pdf（04/24/2012）

Product Change Notice (PCN) (15)

V11-024-480035-0B - Assembly and Test related change.pdf（05/15/2012）
V11-024-480035-0A - Assembly and Test related change.pdf（11/04/2011）
Qualifying New Contract Manufacturers.pdf（03/02/2009）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A03-003-480035-1A, Sept. 2003.pdf（09/30/2003）
PCN: A03-001-480035-1A, Jan 2003.pdf（01/07/2003）
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002.pdf（09/02/2002）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）
022500TC1: Customer Change Notification.pdf（06/01/2000）
032300TC2: Alternative Packaging Subcontractors.pdf（05/01/2000）
CCN:9909a - HSMP-382x and 4820 back metal change.pdf（09/10/1999）
CCN#9904A-REVISION B: Customer Change Notice.pdf（08/01/1999）
CCN:9710a - HSMS, HSMP #L30, #L31.pdf（10/10/1997）
CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change.pdf（06/25/1997）

Reliability Data Sheet (1)

HSMP-38xx HSMP-48xx Surface Mount PIN Diodes.pdf（06/22/2012）

Spice Model (1)

HSMP-382x_APLAC.etc（02/26/2000）

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