HSMS-C150 Surface Mount ChipLEDs

This chip LED Is designed in an industry standard package for ease of handling and use. The HSMS-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. This packageis compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.

Features
  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40OC to 85OC
  • Right Angle Package Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
Applications
  • Keypad backlighting
  • Push-button backlighting
  • LCD backlighting
  • Symbol backlighting
  • Front panel indicator
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Samples AvailableYes
ColorRed
Color Bin SelectionOpen
Dimension Lxwxh In Mm3.2 x 1.6 x 1.1
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeGaP
Lens TypeFlat Top, Diffused, Untinted
Peak Output Current Min (A)1999
Max Qty of Samples20
Minimum Luminous Intensity (mcd)10.0
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsSingle
PackageTop Mount C150
ROHS5_NonLeadFreeY
Test Current (mA)20.0
Typical Forward Voltage In V3.6
Typical Dominant Wavelength (nm)626
Typical Luminous Intensity (mcd)10
Viewing Angle (degree)170°
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (2)
Reliability Data Sheet (1)