HSMS-C191 Low Profile ChipLED

This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMS-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The available colors in this surface mount is HER This package is fully binned by intensity. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel. This package is compatible with IR soldering process.

Features
  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -40°C to 85°C
  • Right Angle & Reverse Mount Package Available
  • Various Colors Available
  • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Dimension Lxwxh In Mm1.6 x 0.8 x 0.6
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeGaP
Max Qty of Samples20
Minimum Luminous Intensity (mcd)2.5
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsSingle
Operating Temperature Range-40°C to +85°C
PackageTape and Reel
Test Current (mA)20.0
Typical Dominant Wavelength (nm)626
Typical Luminous Intensity (mcd)10
Viewing Angle (degree)170°
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (5)
Reliability Data Sheet (1)