HSMY-C191 Low Profile ChipLED

This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMY-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The available colors in this surface mount is yellow This package is fully binned by color and intensity. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel. This package is compatible with IR soldering process.

Features
  • Small size
  • 1.6 mm x 0.8 mm x 0.6 mm
  • Industry standard footprint
  • Diffused optics
  • Operating temperature range of 40oC to 85oC
  • Compatible with IR solder reflow
  • Available in 8 mm tape on 7 in. diameter reels
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Dimension Lxwxh In Mm1.6 x 0.8 x 0.6
Intensity Bin SelectionOpen
RoHS6 CompliantY
Led Chip TypeGaP
Max Qty of Samples20
Minimum Luminous Intensity (mcd)2.5
Peak Output Current Min Uom2a
Mounting DirectionTop
Mounting MethodSurface Mount
Number Of ColorsSingle
Operating Temperature Range-40°C to +85°C
PackageTop Mount Very Low Profile C191
Test Current (mA)20.0
Typical Dominant Wavelength (nm)586
Typical Luminous Intensity (mcd)8
Viewing Angle (degree)170°
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)