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Home > Fairchild Semiconductor > FET > FDMA1032CZ

FDMA1032CZ: 20V Complementary PowerTrench® MOSFET

This device is designed specifically as a single package solution for a DC/DC 'Switching' MOSFET in cellular handset and other ultra-portable applications. It features an independent N-Channel & P-Channel MOSFET with low on-state resistance for minimum conduction losses. The gate charge of each MOSFET is also minimized to allow high frequency switching directly from the controlling device. The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to switching applications.

FDMA1032CZ Datasheet
Features
  • Q1: N-Channel
    3.7 A, 20V
    RDS(ON) = 68 mΩ @ VGS = 4.5V
    RDS(ON) = 86 mΩ @ VGS = 2.5V
  • Q2: P-Channel
    –3.1 A, –20V
    RDS(ON) = 95 mΩ @ VGS = –4.5V
    RDS(ON) = 141 mΩ @ VGS = –2.5V
  • Low profile – 0.8 mm maximum – in the new package MicroFET 2x2 mm
  • HBM ESD protection level > 2 kV (Note 3)
  • RoHS Compliant
  • Free from halogenated compounds and antimony oxides
Ordering Code
ProductProduct & Eco StatusUnit Price/1K OrderPacking Method ConventionPackage Marking Convention*
FDMA1032CZFull Production Green as of Dec 2006  China RoHS$0.4391MLP 2x2 6L (MicroFET)  -  0.8 x 2 x 2mm,  TAPE REEL
  • MLP 2x2 6L (MicroFET)  Drawing Last Update: May 2014
  • MLP06 Packing Drawing Last Update: Oct 2015
  • MLP6L 2.0x2.0, Packing Drawing Last Update: Nov 2014
Line 1&Z (Plant Code)
&2 (2-Digit Date Code)
&K

Line 2032

Application Notes
  • AN-4163 Shielded Gate PowerTrench® MOSFET Datasheet Explanation Last Update : 23-Oct-2014
  • AN-9034 Power MOSFET Avalanche Guideline Last Update : 05-Mar-2011
  • AN-7510 A New PSPICE Subcircuit for the Power MOSFET Featuring Global Temperature Options Last Update : 05-Mar-2011
  • AN-9010 MOSFET Basics Last Update : 09-Sep-2013
  • AN-9065 FRFET® in Synchronous Rectification Last Update : 28-Jun-2014
  • AN-7515 A Combined Single-Pulse and Repetitive UIS Rating System Last Update : 03-Mar-2011
  • AN-7533 A Revised MOSFET Model With Dynamic Temperature Compensation Last Update : 05-Mar-2011
  • AN-558 Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016
  • AN-9005 Driving and Layout Design for Fast Switching Super-Junction MOSFETs Last Update : 26-Nov-2014
  • AN-9053 Assembly Guidelines for MicroFET 2X2 Packaging Last Update : 28-Jun-2014
  • AN-9055 Assembly Guidelines for MicroFET™ 2x2 Dual Packaging Last Update : 08-Apr-2011
  • FDMA1032CZ.pdf
    MOSFET Basics Last Update : 09-Sep-2013
    A Combined Single-Pulse and Repetitive UIS Rating System Last Update : 03-Mar-2011
    FRFET® in Synchronous Rectification Last Update : 28-Jun-2014
    Driving and Layout Design for Fast Switching Super-Junction MOSFETs Last Update : 26-Nov-2014
    Power MOSFET Avalanche Guideline Last Update : 05-Mar-2011
    MLP 2x2 6L (MicroFET)  Drawing Last Update: May 2014
    MLP06 Packing Drawing Last Update: Oct 2015
    MLP6L 2.0x2.0, Packing Drawing Last Update: Nov 2014
    A New PSPICE Subcircuit for the Power MOSFET Featuring Global Temperature Options Last Update : 05-Mar-2011
    A Revised MOSFET Model With Dynamic Temperature Compensation Last Update : 05-Mar-2011
    Shielded Gate PowerTrench® MOSFET Datasheet Explanation Last Update : 23-Oct-2014
    Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016
    Assembly Guidelines for MicroFET 2X2 Packaging Last Update : 28-Jun-2014
    Assembly Guidelines for MicroFET™ 2x2 Dual Packaging Last Update : 08-Apr-2011
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