FDZ197PZ: -20V P-Channel 1.5V Specified PowerTrench® Thin WL-CSP MOSFET

Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" WLCSP packaging process, the FDZ197PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

Features

• Max r_DS(on) = 64 mΩ at V_GS = -4.5 V, I_D = -2.0 A
• Max r_DS(on) = 71 mmΩ at V_GS = -2.5 V, I_D= -2.0 A
• Max r_DS(on) = 79 mmΩ at V_GS = -1.8 V, I_D = -1.0 A
• Max r_DS(on) = 95 mmΩ at V_GS = -1.5 V, I_D = -1.0 A
• Occupies only 1.5 mm2 of PCB area.Less than 50% of thearea of 2 x 2 BGA
• Ultra-thin package: less than 0.65 mm height when mountedto PCB
• ESD Protected
• RoHS Compliant

Application Notes