FDZ371PZ: -20V P-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET

Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ371PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

Features

• Max r_DS(on) = 75 mΩ at V_GS = -4.5 V, I_D = -2.0 A
• Max r_DS(on) = 90 mΩ at V_GS = -2.5 V, I_D = -1.5 A
• Max r_DS(on) = 110 mΩ at V_GS = -1.8 V, I_D = -1.0 A
• Max r_DS(on) = 150 mΩ at V_GS = -1.5 V, I_D = -1.0 A
• Occupies only 1.0 mm2 of PCB area. Less than 30% of thearea of 2 x 2 BGA
• Ultra-thin package: less than 0.4 mm height when mounted to PCB
• HBM ESD protection level >4.4kV typical (Note 3)
• RoHS Compliant

Application Notes