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FPF2C110BI07AS2: F2, Boost and Inverter module with Press-fit
Fairchild's Boost and H-Bridge module is designed for a power stage that needs more compact design. And the Press-fit technology provides simple and reliable mounting. This module is optimized for the application such as solar inverter where a high efficiency and robust design are needed.
| FPF2C110BI07AS2 Datasheet |
Features
- Boost Stage- Dual Boost Topology- SiC Boost Diode- Low RDS(ON) Boost Switch- Low VF and High Voltage Bypass Diode
- Inverter Stage- H-bridge Topology- High Speed IGBT and Fast Recovery FWD
- Integrated DC-capacitor for Boost and Inverter
- Temperature Sensor
- Compact size : F2 Package
- Press-fit Contact Technology
- Al2O3 Substrate with Low Thermal Resistance
| Product | Product & Eco Status | Unit Price/1K Order | Packing Method Convention | Package Marking Convention* |
|---|---|---|---|---|
| FPF2C110BI07AS2 | Full Production ROHS Compliant as of 27-Feb-2006 China RoHS | $69.1333 | HPM F2 30L Pressfit Terminal
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16.4 x 62.8 x 56.7mm,
TRAY
| Line 1$Y (Fairchild logo)
Line 2FPF2C110BI07AS2 |
- HPM F2 30L Pressfit Terminal Drawing Last Update: Jun 2015
- Tray Packing dwg template Last Update: Jun 2015
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