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Home > Fairchild Semiconductor > Power Modules & Intelligent Power Modules > FPF2G120BF07ASP

FPF2G120BF07ASP: F2, 3ch Boost module PCM and NTC

The FPF2G120BF07ASP is the 3ch boost topology which is providing an optimized solution for the multi-string solar application. And the integrated high speed field stop IGBTs and SiC diodes are providing lower conduction and switching losses. And the pre-applied PCM requires no additional process of the thermal interface material printing. Furthermore, the screwclamp provides a fast and reliable mounting method.

FPF2G120BF07ASP Datasheet
Features
  • High Efficiency
  • Low Conduction and Switching Losses
  • High Speed Field Stop IGBT
  • SiC SBD for Boost Diode
  • Built-in NTC for Temperature Monitoring
Ordering Code
ProductProduct & Eco StatusUnit Price/1K OrderPacking Method ConventionPackage Marking Convention*
FPF2G120BF07ASPFull Production ROHS Compliant as of 27-Feb-2006  China RoHS$103.7HPM F2 32L Soldering Terminal  -  16.4 x 62.8 x 56.7mm,  TRAY
  • HPM F2 32L Soldering Terminal  Drawing Last Update: Aug 2015
  • Tray Packing dwg template Last Update: Jun 2015
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Application Notes
  • AN-558 Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016
  • AN-9052 Design Guide for Selection of Bootstrap Components Last Update : 28-Jun-2011
  • AN-6069 Application Review and Comparative Evaluation of Low-Side Gate Driver Last Update : 09-Dec-2013
  • AN-8102 Recommendations to Avoid Short Pulse Width Issues in HVIC Gate Driver Applications Last Update : 01-May-2015
  • AN-6076 Design and Application Guide of Bootstrap Circuit for High-Voltage Gate-Drive IC Last Update : 19-Dec-2014
  • AN-5232 New Generation Super-Junction MOSFETs, SuperFET® II and SuperFET® II Easy Drive MOSFETs for High Efficiency and Lower Switching Noise Last Update : 28-Jun-2014
  • AN-1031 Considerations in Designing the Printed Circuit Boards of Embedded Switching Power Supplies Last Update : 05-Mar-2011
  • AN-7017 Reducing Power Losses in MOSFETs by Controlling Gate Parameters Last Update : 05-Mar-2011
  • AN-4167 Mounting Guideline for F1 / F2 Modules with Press-Fit Pins Last Update : 11-Nov-2015
  • AN-5077 Design Considerations for High Power Module (HPM) Last Update : 04-Dec-2014
  • FPF2G120BF07ASP.pdf
    Application Review and Comparative Evaluation of Low-Side Gate Driver Last Update : 09-Dec-2013
    Recommendations to Avoid Short Pulse Width Issues in HVIC Gate Driver Applications Last Update : 01-May-2015
    Design and Application Guide of Bootstrap Circuit for High-Voltage Gate-Drive IC Last Update : 19-Dec-2014
    New Generation Super-Junction MOSFETs, SuperFET® II and SuperFET® II Easy Drive MOSFETs for High Efficiency and Lower Switching Noise Last Update : 28-Jun-2014
    HPM F2 32L Soldering Terminal  Drawing Last Update: Aug 2015
    Tray Packing dwg template Last Update: Jun 2015
    Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016
    Design Guide for Selection of Bootstrap Components Last Update : 28-Jun-2011
    Considerations in Designing the Printed Circuit Boards of Embedded Switching Power Supplies Last Update : 05-Mar-2011
    Design Considerations for High Power Module (HPM) Last Update : 04-Dec-2014
    Reducing Power Losses in MOSFETs by Controlling Gate Parameters Last Update : 05-Mar-2011
    Mounting Guideline for F1 / F2 Modules with Press-Fit Pins Last Update : 11-Nov-2015
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