BGA713N7
The BGA713L7 is a low current single-band low noise amplifier MMIC for UMTS bands XII, XIII, XIV, XVII and XX. The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile TSNP-7-1 or TSNP-7-2 leadless green packages. This document specifies electrical parameters, pinout, application circuit and packaging of the chip.
| BGA713N7 | |
|---|
| BGA713N7E6327XTSA1 | |
|---|
| active and preferred | |
|---|
| |
|---|
| PG-TSNP-7 | |
|---|
| yes | |
|---|
| yes | |
|---|
| yes | |
|---|
| 7500 | |
|---|
| TAPE & REEL | |
|---|
| 1 | |
|---|
| Sales Product Name | BGA713N7 |
|---|
| OPN | BGA713N7E6327XTSA1 |
|---|
| Product Status | active and preferred |
|---|
| Package Name | PG-TSNP-7 |
|---|
| Completely lead free | yes |
|---|
| Halogen free | yes |
|---|
| RoHS compliant | yes |
|---|
| Packing Size | 7500 |
|---|
| Packing Type | TAPE & REEL |
|---|
| Moisture Level | 1 |
|---|
| Summary of Features:- Gain: 15.5 / -10 dB in high / low gain mode
- Noise figure: 1.1 dB in high gain mode
- Supply current: 4.8 / 0.5 mA in high / low gain mode
- Standby mode (< 2 μA typ.)
- Output internally matched to 50 Ω
- Inputs pre-matched to 50 Ω
- 2 kV HBM ESD protection
- Low external component count
- Small leadlessTSNP-7-1 / TSNP-7-2 packages (2.0 x 1.3 x 0.39 mm)
- Pb-free (RoHS compliant) package
Target Applications:- LNA for LTE and 3G systems
 |
Data Sheet
| Title | Size | Date | Version |
|---|
| BGA713N7,EN | 1.6 MB | 02 Apr 2013 | 03_01 |
Material Content SheetInfo
PCB Design Data
Simulation Models
Simulation Data
Package Data
PCB Design Data
