BSM75GB60DLC

Our well-known  34 mm 600V dual IGBT modules are the right choice for your design.

ParametricBSM75GB60DLC
ConfigurationDual
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.25V
Housing34 mm
Sales Product NameBSM75GB60DLC
OPNBSM75GB60DLCHOSA1
Product Statusnot for new design
Package NameAG-34MM-1
Completely lead freeyes
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Superior solution for frequency controlled inverter drives
  • UL/CSA Certification with UL1557 E83336
  • Operating temperature up to 150 °C
  • Optimized switching characteristic like softness and reduced switching losses
  • Existing packages with higher current capability
  • RoHS compliant
Benefits:
  • Flexibility
  • Optimal electrical performance;
  • Highest reliability
Benefits:
  • Flexibility
  • Optimal electrical performance;
  • Highest reliability
Diagrams
Data Sheet
TitleSizeDateVersion
BSM75GB60DLC,EN/DE125 KB17 Aug 200701_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
模块的评估驱动板；CN2.3 MB25 Nov 2013
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
34 mm & 62 mm IGBT Modules；EN；CN197 KB27 Apr 201607_00
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - 34 mm；EN37 KB06 Jan 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
EN/DE BSM75GB60DLC
EN 2EDN7524G
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EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
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CN 6ED100E12-F2
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DE IFS75B12N3E4_B32
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CN MA070E17
EN MA070E17
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EN DD250S65K3
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN BSM50GB170DN2
EN IFS75B12N3E4_B32
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