Fast and solder-less assembly is possible using our EasyPACK 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Title | Size | Date | Version |
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DF200R12W1H3_B27 (german/english),EN/DE,EN/CN,EN/JA | 747 KB | 15 Apr 2014 | 02_00 |
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Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
Title | Size | Date | Version |
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Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
Assembly Instructions - Easy-PressFIT Modules;EN | 1.5 MB | 29 Apr 2013 | 02_02 |
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Easy & Econo Power Modules;EN;CN | 433 KB | 27 Apr 2016 | 08_00 |
Easy B-series and Easy750 Power modules;EN;CN | 165 KB | 27 Apr 2016 | 07_00 |
PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 Apr 2016 | 08_00 |
Modules for Photo Voltaic String and Multi-String Inverters;EN | 476 KB | 27 Apr 2016 | 04_00 |
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Thermal Heat Sink Interface of IGBT Modules w/o Base Plate;EN | 384 KB | 07 Feb 2014 | |
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
Reliability of PressFIT connections;EN | 472 KB | 06 Jun 2008 | |
PressFIT Technology, a Solderless Method for Mounting Power Modules;EN | 377 KB | 12 Feb 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
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Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Solar Energy Systems;EN | 1.9 MB | 26 Jun 2014 | 01_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
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MCDS - Easy1-B;EN | 38 KB | 06 Jan 2014 | 03_00 |
Board | Family | Description | Status |
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2ED300E17-SFO | Gate Driver, IGBT Modules | This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -ST | on request |
2ED300C17-S | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
2ED300C17-ST | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 Mar 2014 |