DF75R12W1H4F_B11

Fast and solder-less assembly is possible using our  EasyPACK 1B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H2.

ParametricDF75R12W1H4F_B11
ConfigurationChopper
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)2.1V
VF (Tvj=25°C typ)1.6V
HousingEasyPACK 1B
Sales Product NameDF75R12W1H4F_B11
OPNDF75R12W1H4FB11BOMA1
Product Statusactive
Package NameAG-EASY1B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • High Speed IGBT H2
  • Low Switching Losses
  • CoolSiC™ Schottky diode 1200V
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
Benefits:
  • Compact design
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact design
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
DF75R12W1H4F_B11 (german/english),EN/DE,EN/CN,EN/JA766 KB10 Dec 201303_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 Apr 201302_02
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 Apr 201604_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 Apr 201608_00
Easy B-series and Easy750 Power modules；EN；CN165 KB27 Apr 201607_00
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
Reliability of PressFIT connections；EN472 KB06 Jun 2008
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 Feb 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 Feb 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 Jun 201401_00
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-B SiC；EN48 KB29 Jan 201501_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
EN/CN DF75R12W1H4F_B11
EN/DE DF75R12W1H4F_B11
EN/JA DF75R12W1H4F_B11
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