F3L200R07PE4

EconoPACK™ 4 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC

ParametricF3L200R07PE4
Configuration3-level
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.55V
HousingEconoPACK™ 4
Sales Product NameF3L200R07PE4
OPNF3L200R07PE4BOSA1
Product Statusactive and preferred
Package NameAG-ECONO4-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size6
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • Extended Operation Temperature T (vj op)
  • T(vj op) = 150°C
  • V (CEsat) with positive Temperature Coefficient
  • 4 kV AC 1min Insulation
  • High mechanical robustness
  • Integrated NTC temperature sensor
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Diagrams
Data Sheet
TitleSizeDateVersion
F3L200R07PE4 (german/english),EN/DE,EN/CN,EN/JA866 KB06 Mar 201302_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Evaluation Adapter Board for EconoPACK™4 3-Level Modules in NPC1-Topology；EN；CN1.4 MB21 Jun 2011
Evaluation Driver Board for EconoPACK™4 3-Level Modules in NPC1-Topology with 1ED020I12-F gate driver IC；EN；CN1.3 MB21 Jun 2011
Assembly Instructions EconoPACK™4 Modules；EN；DE；CN950 KB01 Feb 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
3-Level Inverter Modules；EN307 KB27 Apr 201608_00
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 Apr 201607_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 Apr 201608_00
EconoPACK™4 Power Modules；EN106 KB27 Apr 201607_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
IGBT Module technology state of the art and future evolutions；EN37 KB07 Feb 2014
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time；EN191 KB31 Jan 2011
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 Jun 201401_00
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 Jul 2014
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoPACK4；EN58 KB06 Jan 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
F3L020E07-F-PIGBT ModulesEvaluation Driver board for 650V 3-level EconoPACK™ 4 modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving 650V EconoPACK™ 4 3-level IGBT Modules (NPC1)on request
MA3L080E07IGBT ModulesEvaluation Adapter Board with booster stage for EconoPACK™ 4 3-Level Modules in NPC1-Topology (650V)For connecting 650V EconoPACK™ 4 IGBT Modules (NPC1) and Driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
F3L200R07PE4 | EconoPACK™4 module | AG-ECONO4-1-1；EN514 KB11 Apr 201601_00
EN/CN F3L200R07PE4
EN/DE F3L200R07PE4
EN/JA F3L200R07PE4
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN MA3L080E07
EN MA3L080E07
CN MA3L080E07
EN MA3L120E07
CN FS100R17PE4
EN FS100R17PE4
DE FS100R17PE4
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN F3L2020E12-F-P_EVAL
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EN TDB6HK180N16RR_B11
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EN BYM600A170DN2
EN DD250S65K3
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN XMC4500-E144X1024+AC
EN IDV20E65D1
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN F3L200R07PE4
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