EconoDUAL™ 3 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled Diode and NTC1 upper switch.
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F3L400R07ME4_B22 (german/english),EN/DE,EN/CN,EN/JA | 768 KB | 08 Mar 2013 | 03_01 |
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Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
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Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05);EN;CN | 630 KB | 05 Feb 2008 | |
Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules;EN | 1.9 MB | 05 May 2011 | |
Mounting instructions EconoDUAL™ 3 Modules;EN;DE;CN | 818 KB | 10 Feb 2014 | |
Soldering of Econo and Easy Modules;EN | 194 KB | 10 Feb 2014 | |
Module Adapter Board for EconoDUAL™3 IGBT Modules;EN | 1.1 MB | 14 Feb 2010 | |
Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 |
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3-Level Inverter Modules;EN | 307 KB | 27 Apr 2016 | 08_00 |
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules;EN | 440 KB | 27 Apr 2016 | 07_00 |
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FPGA to Control Power Electronics;EN | 246 KB | 01 Oct 2014 | |
Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014;DE | 512 KB | 14 May 2014 |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
„Econo“ my improvement in inverter-converter-moduldesign;EN | 90 KB | 07 Feb 2014 | |
IGBT Module technology state of the art and future evolutions;EN | 37 KB | 07 Feb 2014 | |
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time;EN | 191 KB | 31 Jan 2011 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
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Solutions for Solar Energy Systems;EN | 1.9 MB | 26 Jun 2014 | 01_00 |
Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Traction Systems;EN | 1.5 MB | 27 Apr 2016 | 08_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
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MCDS - EconoDUAL 3;EN | 529 KB | 06 Jan 2014 | 04_00 |
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IPOSIM;EN | 3.4 MB | 18 Mar 2014 |