F3L50R06W1E3_B11

EasyPACK 1B 600V 3-level phase leg IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode, NTC and PressFIT Contact Technology

ParametricF3L50R06W1E3_B11
Configuration3-level
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEasyPACK 1B
Sales Product NameF3L50R06W1E3_B11
OPNF3L50R06W1E3B11BOMA1
Product Statusactive and preferred
Package NameAG-EASY1B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • Low inductive design
  • Low Switching Losses
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Compact Design
  • PressFIT Contract Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
F3L50R06W1E3_B11 (german/english),EN/DE,EN/CN,EN/JA824 KB31 Mar 201403_01
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 Apr 201302_02
Characteristic differences between 1200V IGBT3 modules of E3 and T3 series；EN；CN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
Easy B-series and Easy750 Power modules；EN；CN165 KB27 Apr 201607_00
3-Level Inverter Modules；EN307 KB27 Apr 201608_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 Apr 201608_00
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 Apr 201604_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
Reliability of PressFIT connections；EN472 KB06 Jun 2008
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 Feb 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 Feb 2014
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 Jun 201401_00
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-B；EN38 KB06 Jan 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
F3L50R06W1E3_B11 | EasyPACK module | AG-EASY1B-2-1；EN545 KB11 Apr 201601_00
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