FF1400R12IP4P

1200V PrimePACK™3 dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material.

ParametricFF1400R12IP4P
ConfigurationDual
IC(nom) / IF(nom)1400.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.9V
HousingPrimePACK™ 3
Sales Product NameFF1400R12IP4P
OPNFF1400R12IP4PBOSA1
Product Statusactive and preferred
Package NameAG-PRIME3-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size3
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(tvj op)
  • High DC Stability
  • High Short Circuit Capability, Self Limiting Short Circuit Current
  • Unbeatable Robustness
  • Vce(sat) with positive Temperature Coefficient
  • Low Vce(sat)
  • 4kV AC 1min Insulation
  • Package with CTI > 400
  • High Creepage and Clearance Distances
  • High Power and Thermal Cycling Capability
  • Substrate for Low Thermal Resistance
  • UL recognized
Benefits:
  • High Power Density
  • Standardized housing
Benefits:
  • High Power Density
  • Standardized housing
Diagrams
Data Sheet
TitleSizeDateVersion
FF1400R12IP4P (german/english),EN/DE,CN/EN,JA/EN637 KB04 Apr 201603_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Module Adapter Board for PrimePACK™；EN；CN1.1 MB14 Dec 2010
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Series connection of IGBTs；EN28 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Paralleling of IGBTs；EN28 KB10 Feb 2014
Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05)；EN；CN630 KB05 Feb 2008
Modules with pre-applied Thermal interface Material；EN393 KB26 Jan 201601_01
Assembly Instructions PrimePACK™ Modules；EN；CN2.3 MB27 Mar 201402_00
Driving IGBTs with unipolar gate voltage；EN389 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 Apr 201604_00
IHM, IHV Modules & PrimePACK™；EN452 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 Jan 2011
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 Feb 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 Feb 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 Jun 201401_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 Jul 2014
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Solutions for Wind Energy Systems；EN5.4 MB18 Apr 2013
Solutions for Traction Systems；EN1.5 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - PP3 89x250 TIM；EN40 KB13 Apr 201606_00
Evaluation Boards
BoardFamilyDescriptionStatus
MA300E12IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1200V PrimePACK™ in single or parallel configuration. For connecting 1200V PrimePACK™ IGBT Modules and driver boardson request
2ED250E12-FIGBT ModulesEvaluation Driver Board for PrimePACK™ Modules up to 1200V using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).Equipped with EiceDRIVER™ 1ED020I12-FFor driving PrimePACK™ IGBT Moduleson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
CN/EN FF1400R12IP4P
EN/DE FF1400R12IP4P
JA/EN FF1400R12IP4P
EN 2EDN7524G
EN 1EDI60I12AH
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FF1400R17IP4
EN FF1400R17IP4
CN 2ED300C17-ST
EN 2ED300C17-ST
CN FF1400R17IP4
EN 2ED300E17-SFO
EN IFS75B12N3E4_B32
EN FF1400R17IP4P
EN IFS75B12N3E4_B32
EN MA401E17
EN FF1400R17IP4P
EN BYM600A170DN2
EN FP75R17N3E4
EN DD250S65K3
EN FP75R17N3E4
EN DD250S65K3
EN FF1400R17IP4
EN IFS75B12N3E4_B32
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FF1400R17IP4P
EN IFS75B12N3E4_B32
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