Our well-known 62 mm 1200V 3-level IGBT modules with common emitter and fast trench/fieldstop IGBT3 and Thermal Interface Material (TIM) pre applied. 3-level phase leg configurations are possible in combination with our 1200V 62 mm dual modules.
Title | Size | Date | Version |
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FF300R12KT3P_E (german/english),EN/DE,CN/EN,JA/EN | 538 KB | 25 Apr 2016 | 02_01 |
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1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
Title | Size | Date | Version |
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Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Evaluation Adapter Board for 62mm Half Bridge IGBT Modules;EN | 969 KB | 08 Nov 2013 | |
Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Simple and reliable connecting system of 62 mm C- Series IGBT Modules to a Power Circuit Board (PCB);EN | 111 KB | 10 Feb 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
62mm Modules Application and Assembly Notes;EN;DE | 1.5 MB | 14 Mar 2013 | |
Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05);EN;CN | 630 KB | 05 Feb 2008 | |
Modules with pre-applied Thermal interface Material;EN | 393 KB | 26 Jan 2016 | 01_01 |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Title | Size | Date | Version |
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34 mm & 62 mm IGBT Modules;EN;CN | 197 KB | 27 Apr 2016 | 07_00 |
Thermal Interface Material (TIM) - The only Infineon-qualified solution;EN | 410 KB | 27 Apr 2016 | 04_00 |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 |
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Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Traction Systems;EN | 1.5 MB | 27 Apr 2016 | 08_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
Solutions for construction, commercial and agricultural vehicles (CAV);EN | 6.7 MB | 30 Jul 2014 |
Title | Size | Date | Version |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
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MCDS - 62mm TIM;EN | 28 KB | 15 Mar 2016 | 01_00 |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 Mar 2014 |