1200V PrimePACK™ 2 dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material.
Title | Size | Date | Version |
---|---|---|---|
FF900R12IE4P (german/english),EN/DE,CN/EN,JA/EN | 635 KB | 04 Apr 2016 | 02_00 |
Title | Size | Date | Version |
---|---|---|---|
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Title | Size | Date | Version |
---|---|---|---|
Module Adapter Board for PrimePACK™;EN;CN | 1.1 MB | 14 Dec 2010 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Assembly Instructions PrimePACK™ Modules;EN;CN | 2.3 MB | 27 Mar 2014 | 02_00 |
Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Modules with pre-applied Thermal interface Material;EN | 393 KB | 26 Jan 2016 | 01_01 |
Title | Size | Date | Version |
---|---|---|---|
Thermal Interface Material (TIM) - The only Infineon-qualified solution;EN | 410 KB | 27 Apr 2016 | 04_00 |
IHM, IHV Modules & PrimePACK™;EN | 452 KB | 27 Apr 2016 | 08_00 |
Title | Size | Date | Version |
---|---|---|---|
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 | |
Properties of a New PrimePACK™ IGBT Module Concept;EN | 213 KB | 07 Feb 2014 | |
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?;EN | 731 KB | 31 Jan 2011 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
Title | Size | Date | Version |
---|---|---|---|
Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
Solutions for Traction Systems;EN | 1.5 MB | 27 Apr 2016 | 08_00 |
Solutions for Wind Energy Systems;EN | 5.4 MB | 18 Apr 2013 | |
Solutions for Solar Energy Systems;EN | 1.9 MB | 26 Jun 2014 | 01_00 |
Title | Size | Date | Version |
---|---|---|---|
Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
Title | Size | Date | Version |
---|---|---|---|
MCDS - PP2 89x172 TIM;EN | 40 KB | 13 Apr 2016 | 06_00 |
Board | Family | Description | Status |
---|---|---|---|
MA300E12 | IGBT Modules | Evaluation Adapter board containing a booster stage for driving 1200V PrimePACK™ in single or parallel configuration. For connecting 1200V PrimePACK™ IGBT Modules and driver boards | on request |
2ED250E12-F | IGBT Modules | Evaluation Driver Board for PrimePACK™ Modules up to 1200V using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).Equipped with EiceDRIVER™ 1ED020I12-FFor driving PrimePACK™ IGBT Modules | on request |
Title | Size | Date | Version |
---|---|---|---|
IPOSIM;EN | 3.4 MB | 18 Mar 2014 |