FP35R12KT4_B15

EconoPIM™ 2 1200V three phase PIM IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC (alternative mechnically compatible to an IGBT3 module)

ParametricFP35R12KT4_B15
ConfigurationPIM Three Phase Input Rectifier
IC(nom) / IF(nom)35.0A
VCE(sat) (Tvj=25°C typ)1.85V
VF (Tvj=25°C typ)1.7V
HousingEconoPIM™ 2
Sales Product NameFP35R12KT4_B15
OPNFP35R12KT4B15BOSA1
Product Statusactive and preferred
Package NameAG-ECONO2-5
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Low V(CEsat)
  • T(vj op) = 150°C
  • V(CEsat) with positive Temperature Coefficient
  • High Power and Thermal Cycling Capability
  • Copper Base Plate
  • Solder Contact Technology
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FP35R12KT4_B15 (german/english),EN/DE,EN/CN,EN/JA826 KB06 Dec 201302_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 Jan 2011
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 Feb 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo2C；EN37 KB06 Jan 201403_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
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