EconoPACK™ 3 1700V sixpack IGBT module with trench/fieldstop IGBT4, Emitter Controlled Diode, NTC and PressFIT Contact Technology
| Title | Size | Date | Version |
|---|---|---|---|
| FS100R17N3E4_B11,EN/DE | 537 KB | 30 Aug 2012 | 02_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
| Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
| Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
| Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
| Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
| Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
| Mounting instruction for PressFIT with forked pins;EN;DE | 675 KB | 04 Dec 2012 | |
| Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
| Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
| Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
| Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
| Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 |
| Title | Size | Date | Version |
|---|---|---|---|
| Easy & Econo Power Modules;EN;CN | 433 KB | 27 Apr 2016 | 08_00 |
| PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 Apr 2016 | 08_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Reliability of PressFIT connections;EN | 472 KB | 06 Jun 2008 | |
| Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
| PressFIT Technology, a Solderless Method for Mounting Power Modules;EN | 377 KB | 12 Feb 2014 | |
| Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 | |
| The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
| Title | Size | Date | Version |
|---|---|---|---|
| Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
| Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| MCDS - Econo3B;EN | 37 KB | 06 Jan 2014 | 03_00 |
| Board | Family | Description | Status |
|---|---|---|---|
| 2ED300E17-SFO | Gate Driver, IGBT Modules | This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -ST | on request |
| 2ED300C17-S | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
| 2ED300C17-ST | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
| Title | Size | Date | Version |
|---|---|---|---|
| IPOSIM;EN | 3.4 MB | 18 Mar 2014 |