FS200R07N3E4R_B11

EconoPACK™ 3 650V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

ParametricFS200R07N3E4R_B11
ConfigurationSixpack
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.55V
HousingEconoPACK™ 3
Sales Product NameFS200R07N3E4R_B11
OPNFS200R07N3E4RB11BOSA1
Product Statusactive and preferred
Package NameAG-ECONO3-4
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • High Short Circuit Capability, Self Limiting Short Circuit Current
  • T(vj op) = 150°C
  • Integrated NTC temperature sensor
  • Copper Base Plate
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FS200R07N3E4R_B11 (german/english),EN/DE,EN/CN,EN/JA718 KB08 Mar 201302_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Mounting instruction for PressFIT with forked pins；EN；DE675 KB04 Dec 2012
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time；EN191 KB31 Jan 2011
Reliability of PressFIT connections；EN472 KB06 Jun 2008
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 Feb 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo3B；EN37 KB06 Jan 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
EN/CN FS200R07N3E4R_B11
EN/DE FS200R07N3E4R_B11
EN/JA FS200R07N3E4R_B11
EN 2EDN7524G
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CN IFS75B12N3E4_B32
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EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
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EN TDB6HK180N16RR_B11
DE TDB6HK180N16RR_B11
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
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EN F3L030E07-F-W2
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