FS200R12PT4P

EconoPACK™ 4 1200V sixpack IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material.

ParametricFS200R12PT4P
ConfigurationSixpack
IC(nom) / IF(nom)200.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.7V
HousingEconoPACK™ 4
Sales Product NameFS200R12PT4P
OPNFS200R12PT4PBOSA1
Product Statusactive and preferred
Package NameAG-ECONO4-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size6
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(vj op)
  • Low Switching Losses
  • Low V(CEsat)
  • V(CEsat) with positive Temperature Coefficient
  • 2.5 kV AC 1min Insulation
  • High Power Density
  • Isolated Base Plate
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Diagrams
Data Sheet
TitleSizeDateVersion
FS200R12PT4P (german/english),EN/DE,CN/EN,JA/EN744 KB19 Apr 201602_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Application Notes
TitleSizeDateVersion
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Paralleling of IGBTs；EN28 KB10 Feb 2014
Assembly Instructions EconoPACK™4 Modules；EN；DE；CN950 KB01 Feb 2013
Modules with pre-applied Thermal interface Material；EN393 KB26 Jan 201601_01
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Series connection of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 Apr 201604_00
EconoPACK™4 Power Modules；EN106 KB27 Apr 201607_00
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 Apr 201607_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
IGBT Module technology state of the art and future evolutions；EN37 KB07 Feb 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 Feb 2014
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 Jan 2011
Application Brochure
TitleSizeDateVersion
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 Jul 2014
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
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