FS30R06W1E3

EasyPACK 1B 600V sixpack IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC.

ParametricFS30R06W1E3
ConfigurationSixpack
IC(nom) / IF(nom)30.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.6V
HousingEasyPACK 1B
Sales Product NameFS30R06W1E3
OPNFS30R06W1E3BOMA1
Product Statusactive and preferred
Package NameAG-EASY1B-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Trench IGBT 3
  • V(CEsat) with positive Temperature Coefficient
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Restistance
  • Compact Design
  • Solder Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FS30R06W1E3 (german/english),EN/DE,EN/CN,EN/JA775 KB03 Dec 201302_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Application Notes
TitleSizeDateVersion
Mounting Instructions for EasyPIM™ and EasyPACK Modules；EN；DE845 KB29 Apr 2013
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Characteristic differences between 1200V IGBT3 modules of E3 and T3 series；EN；CN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
Easy B-series and Easy750 Power modules；EN；CN165 KB27 Apr 201607_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 Feb 2014
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 May 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-B；EN38 KB06 Jan 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
FS30R06W1E3 | EasyPACK module | AG-EASY1B-1-1；EN542 KB11 Apr 201601_00
EN/CN FS30R06W1E3
EN/DE FS30R06W1E3
EN/JA FS30R06W1E3
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DE IFS75B12N3E4_B32
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EN IFS75B12N3E4_B32
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EN IFS75B12N3E4_B32
EN FS30R06W1E3
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