FS50R06W1E3

EasyPACK 1B 600V sixpack IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC.

ParametricFS50R06W1E3
ConfigurationSixpack
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEasyPACK 1B
Sales Product NameFS50R06W1E3
OPNFS50R06W1E3BOMA1
Product Statusactive and preferred
Package NameAG-EASY1B-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size24
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Trench IGBT 3
  • V(CEsat) with positive Temperature Coefficient
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Restistance
  • Compact Design
  • Solder Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Diagrams
Data Sheet
TitleSizeDateVersion
FS50R06W1E3 (german/english),EN/DE,EN/CN,EN/JA786 KB03 Dec 201302_01
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 milEN216 KB09 May 201601_00
Best-in-class products to meet your application demandsEN1.3 MB27 Apr 201608_00
Product Brochure Industrial Gate Driver ICs OverviewEN613 KB27 Apr 201603_00
Application Notes
TitleSizeDateVersion
Mounting Instructions for EasyPIM™ and EasyPACK ModulesENDE845 KB29 Apr 2013
Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltageENCN389 KB10 Feb 2014
Soldering of Econo and Easy ModulesEN194 KB10 Feb 2014
Using the NTC inside a power moduleENCN295 KB13 Jan 2010
Application Note IGBT Definition of Junction TemperatureEN84 KB09 Apr 2009
Characteristic differences between 1200V IGBT3 modules of E3 and T3 seriesENCN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)ENDECN295 KB20 Jun 2008
Deadtime calculation for IGBT ModulesENCN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 Feb 2014
Series connection of IGBTsEN28 KB10 Feb 2014
Paralleling of IGBTsEN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power ModulesENCN433 KB27 Apr 201608_00
Easy B-series and Easy750 Power modulesENCN165 KB27 Apr 201607_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 Nov 201501_00
Thermal Heat Sink Interface of IGBT Modules w/o Base PlateEN384 KB07 Feb 2014
Impact of module parasitics on the performance of fast-switching devicesEN3.7 MB31 May 2014
The challenge of accurately analyzing thermal resistancesEN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial DrivesEN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) SystemsEN2.6 MB27 Apr 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy1-BEN38 KB06 Jan 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIMEN3.4 MB18 Mar 2014
EN/CN FS50R06W1E3
EN/DE FS50R06W1E3
EN/JA FS50R06W1E3
EN 1EDI60I12AH
EN IFS75B12N3E4_B32
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS10R12VT3
DE FS25R12W1T4
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
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CN FZ250R65KE3
EN FZ250R65KE3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN DD250S65K3
EN FS10R12VT3
EN FS3L25R12W2H3_B11
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U75N16W1R_B11
EN IFS75B12N3E4_B32