EconoPACK™ 2 650 V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology
Title | Size | Date | Version |
---|---|---|---|
FS50R07N2E4_B11 (german/english),EN/DE,EN/CN,EN/JA | 700 KB | 02 Dec 2013 | 02_00 |
Title | Size | Date | Version |
---|---|---|---|
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
Title | Size | Date | Version |
---|---|---|---|
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Mounting instruction for PressFIT with forked pins;EN;DE | 675 KB | 04 Dec 2012 | |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 |
Title | Size | Date | Version |
---|---|---|---|
Easy & Econo Power Modules;EN;CN | 433 KB | 27 Apr 2016 | 08_00 |
PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 Apr 2016 | 08_00 |
Title | Size | Date | Version |
---|---|---|---|
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time;EN | 191 KB | 31 Jan 2011 | |
Reliability of PressFIT connections;EN | 472 KB | 06 Jun 2008 | |
PressFIT Technology, a Solderless Method for Mounting Power Modules;EN | 377 KB | 12 Feb 2014 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
Title | Size | Date | Version |
---|---|---|---|
Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
Title | Size | Date | Version |
---|---|---|---|
Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
Title | Size | Date | Version |
---|---|---|---|
MCDS - Econo2B;EN | 36 KB | 06 Jan 2014 | 03_00 |
Title | Size | Date | Version |
---|---|---|---|
IPOSIM;EN | 3.4 MB | 18 Mar 2014 |