FS6R06VE3_B2

EasyPACK 750 600V sixpack IGBT module with IGBT3 and NTC.

ParametricFS6R06VE3_B2
ConfigurationSixpack
IC(nom) / IF(nom)6.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.6V
HousingEasyPACK 750
Sales Product NameFS6R06VE3_B2
OPNFS6R06VE3B2BOMA1
Product Statusactive
Package NameAG-EASY750-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size40
Packing TypeTRAY
Summary of Features:
  • High power density
  • Established Easy module concept
  • Integrated temperature sensor available
  • Low stray inductance module design
  • RoHS-compliant modules
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
  • Fast, reliable and low cost mounting concept
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
  • Fast, reliable and low cost mounting concept
Diagrams
Data Sheet
TitleSizeDateVersion
FS6R06VE3_B2 (german/english),EN/DE,EN/CN,EN/JA453 KB02 Dec 201302_00
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 May 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Application Notes
TitleSizeDateVersion
Soldering of Econo and Easy Modules；EN194 KB10 Feb 2014
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
Mounting Instructions for EasyPIM™750 and EasyPACK750 Modules with screw clamps；EN302 KB10 Feb 2014
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Characteristic differences between 1200V IGBT3 modules of E3 and T3 series；EN；CN252 KB10 Feb 2014
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 Feb 2014
Series connection of IGBTs；EN28 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Product Brief
TitleSizeDateVersion
Easy & Econo Power Modules；EN；CN433 KB27 Apr 201608_00
Additional Technical Information
TitleSizeDateVersion
Clamp Easy750GEO；EN/DE61 KB29 Feb 201602_05
Editorials
TitleSizeDateVersion
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 Feb 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy750；EN77 KB06 Feb 201503_01
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
Package Data
TitleSizeDateVersion
FS6R06VE3_B2 | AG-EASY750-1-1；EN376 KB11 Apr 201601_00
EN/CN FS6R06VE3_B2
EN/DE FS6R06VE3_B2
EN/JA FS6R06VE3_B2
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN 2EDN7524G
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS10R12VT3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FZ250R65KE3
EN FZ250R65KE3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN/DE FS6R06VE3_B2
EN DD250S65K3
EN FS10R12VT3
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U30N08VR
EN IFS75B12N3E4_B32
EN FS6R06VE3_B2
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