S-MFC5.4

S-MFC5.4-6-1 Module is the optimized package solution to support 4FF application as smaller module dimensions (10,42 mm x 7.58 mm) ensure enough distance from module to card edge, reduced module thickness (max. 420µm) ensure easy implementation in thinner card bodies and easy card integration by use of same process parameters and materials as for standard FCOS™ implanting (only new punching tool required) is possible. With a Package thickness of max. 420µm also laser engraving at the full area of card back side is possible.

ParametricS-MFC5.4
Product DescriptionContact-based module; 6 Contacts; FCOS™ technology; transparent PET Tape
Pitch9.5mm
Dimensions10.4 x 7.6mm
Thicknessmax. 420µm
Contact SurfaceAg
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface, S-MFC5.4-6-1
Delivery FormsTape on Reel
ApplicationsSIM & UICC
Product NameS-MFC5.4
Summary of Features:
  • 9.5mm
  • 10.4 x 7.6mm
  • max. 420µm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, S-MFC5.4-6-1
  • Tape on Reel
Target Applications:
  • GSM
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 Feb 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 Nov 201511_15
EN S-COM86
EN S-COM86