S-MFC6.8

With the MFC6.x product series Infineon offers black lined premium Flip Chip packages with an quivalent appearance like epoxy tape. In combination with an optimized card cavtiy this products offer advantages for mechanical robustness, module flatness in card and improved image of card backside in area of module milling cavity. For the Payment market this products are also availabel with palladium surface.

ParametricS-MFC6.8
Product DescriptionBlack lined contact-based module; 8 Contacts
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 470µm
Contact SurfaceNiAu
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface, Pd surface, S-MFC6.8-8-1, S-MFC6.8-8-3
Delivery FormsTape on Reel
ApplicationsPayment, Government Identification
Product NameS-MFC6.8
Summary of Features:
  • 14.25mm
  • 13 x 11.8mm
  • max. 470µm
  • NiAu
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface, S-MFC6.8-8-1, S-MFC6.8-8-3
  • Tape on Reel
Target Applications:
  • Payment,
  • EMV SDA/DDA,
  • ID
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 Feb 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 Nov 201511_15
EN S-COM86
EN S-COM86