SLE 77CLFX1367P(M)
Bundling Infineon’s long-standing experience in contactless applications, the SLE 77CLFX is the ideal platform for EMV migrations where outstanding contactless performance is required. Highlights include
SLE 77CLFX is the ideal platform for multi-application solutions. Large and scalable memory supports the convergence of payment functionality with other applications such as loyalty schemes.
| Parametric | SLE 77CLFX1367P(M) |
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| Product Description | Contactless security cryptocontroller with dual-interface |
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| Interfaces | ISO 14443 A/B |
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| Interfaces | ISO 18092 passive mode |
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| Interfaces | ISO 7816 |
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| Interfaces | Mifare compatible |
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| Interfaces | optimized for sub-ID1 |
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| NVM / 凌捷掩膜 | 136.0kByte |
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| RAM | 6.0kByte |
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| Ambient Temperature
min
max | -25.0°C
85.0°C |
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| Asymmetrical Cryptography | ECC up to 521-bit |
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| Asymmetrical Cryptography | RSA up to 4096-bit |
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| Symmetrical Cryptography | 3DES |
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| Symmetrical Cryptography | AES up to 256-bit |
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| Symmetrical Cryptography | DES |
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| CPU | 16-bit |
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| Certifications | CC EAL5+ high |
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| Certifications | EMVCo |
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| Delivery Forms | Coil on Module |
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| Delivery Forms | MCC8 |
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| Delivery Forms | Wafer sawn |
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| Applications | Payment |
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| Sales Product Name | SLE 77CLFX1367P(M) |
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| OPN | |
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| Product Status | active and preferred |
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| Package Name | -- |
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| Completely lead free | yes |
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| Halogen free | yes |
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| RoHS compliant | yes |
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| Packing Size | 1 |
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| Packing Type | WAFER SAWN |
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| Description:- a powerful 16-bit core
- state-of-the-art 90nm technology
- SOLID FLASH™ for record time-to-market
- Common criteria EAL 5+(high)
- EMVCo certified
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Application Brochure
Product Selection Guide
Whitepaper
