T-M4.8

Contact-based module 8 contacts Epoxy Tape Wire Bond Glob Top

ParametricT-M4.8
Product DescriptionContact-based module 8 Contacts Epoxy Tape Wire Bond Glob Top
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 580μm
Contact SurfaceCIN
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface, Pd surface, T-M4.8-8-1, T-M4.8-8-2
Delivery FormsTape on Reel
ApplicationsPayment, Government Identification, Pay-TV
Product NameT-M4.8
Sales Product NameT-M4.8
OPN
Product Statusactive and preferred
Package NameT-M4.8-8
Completely lead freeyes
Halogen freeyes
RoHS compliantyes
Packing Size1
Packing TypeREEL FOR CHIP CARD
Summary of Features:
  • 14.25mm
  • 13 x 11.8mm
  • max. 580μm
  • CIN
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface, T-M4.8-8-1, T-M4.8-8-2
  • Tape on Reel
Target Applications:
  • Payment,
  • Government Identification,
  • Pay-TV
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 Feb 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 Nov 201511_15
EN S-COM86
EN S-COM86