T-M8.8 infineon _ BDTIC a Leading Distributor in China

Dual Interface Module, 8 contacts CB, 2 Antenna contacts, Epoxy Tape, Wire Bond, Glob Top

Parametric	T-M8.8
Product Description	Dual Interface Module, 8 contacts CB, 2 Antenna contacts, Epoxy Tape, Wire Bond, Glob Top
Pitch	14.25mm
Dimensions	13 x 11.8mm
Thickness	max. 580μm
Contact Surface	Au
ISO – Reference	ISO 7816-1, ISO 7810, ISO 10373-1/-3
Derivatives	Au surface, Pd surface
Delivery Forms	Tape on Reel
Applications	Payment, Government Identification
Product Name	T-M8.8

Title	Size	Date	Version
Security for the connected world；EN	1.5 MB	18 Feb 2016	02_16

Title	Size	Date	Version
Infineon Chip Card & Security ICs Portfolio；EN	2.1 MB	03 Nov 2015	11_15

EN S-COM86