T-M8.8

Dual Interface Module, 8 contacts CB, 2 Antenna contacts, Epoxy Tape, Wire Bond, Glob Top

ParametricT-M8.8
Product DescriptionDual Interface Module, 8 contacts CB, 2 Antenna contacts, Epoxy Tape, Wire Bond, Glob Top
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 580μm
Contact SurfaceAu
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface, Pd surface
Delivery FormsTape on Reel
ApplicationsPayment, Government Identification
Product NameT-M8.8
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 Feb 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 Nov 201511_15
EN S-COM86
EN S-COM86