| Parametric | TD175N16SOF |
|---|
| VDRM / VRRM [V] | 1600.0 |
|---|
| IFAVM/TC / ITAVM/TC [A/°C]
(@180° el sin) | 175/85 |
|---|
| IFSM / ITSM [A]
(@10ms, Tvj max) | 5000.0 |
|---|
| ∫I2dt [A²s · 103]
(@10ms, Tvj max) | 125.0 |
|---|
| VT0 [V]
(@Tvj max)
max | 0.83 |
|---|
| rT [mΩ]
(@Tvj max)
max | 1.3 |
|---|
| (diT/dt)cr [A/µs]
(@DIN IEC 747- 6) | 200.0 |
|---|
| RthJC [K/W]
(@180° el sin)
max | 0.164 |
|---|
| Tvj [°C]
max | 125.0 |
|---|
| Housing | PowerBLOCK 34 mm |
|---|
| Configuration | SCR / Diode Phase Control |
|---|
| IFSM / ITSM | 5000.0A |
|---|
| VDRM/ VRRM (V) | 1600.0V |
|---|
| IFAVM / TC / ITAVM / TC | 175/85 (180° el sin) A/°C |
|---|
| Sales Product Name | TD175N16SOF |
|---|
| OPN | TD175N16SOFHPSA1 |
|---|
| Product Status | active and preferred |
|---|
| Package Name | BG-PB34SB-1 |
|---|
| Completely lead free | yes |
|---|
| Halogen free | no |
|---|
| RoHS compliant | yes |
|---|
| Packing Size | 10 |
|---|
| Packing Type | TRAY |
|---|
| |
|---|
| Summary of Features:- Solder-Bond Technology
- Industrial standard package
- Electrically insulated copper base plate
Benefits:- Cost effective
- Low weight
- UL recognized
Benefits:- Cost effective
- Low weight
- UL recognized
 Diagrams |
