HCS370
The HCS370 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS370 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low cost, to make this device a perfect solution for unidirectional remote keyless entry systems and access control systems. The HCS370 combines a 32-bit hopping code generated by a non-linear encryption algorithm, with a 28/32-bit serial number and 5/3 status bits to create a 69-bit transmission stream. The length of the transmission eliminates the threat of code scanning and the code hopping mechanism makes each transmission unique, thus rendering code capture and re-send (code grabbing) schemes useless. The encoder key, serial number, and configuration data are stored in EEPROM, which is not accessible via any external connection. This makes the HCS370 a very secure unit. The HCS370 provides an easy-to-use serial interface for programming the necessary security keys, system parameters, and configuration data. The HCS370 operates over a wide voltage range of 2.05V to 5.5V and has four button inputs in an 14-pin configuration. This allows the system designer the freedom to utilize up to 15 functions.
Features- PWM, VPWM, PPM, Manchester Encoding
- Internal Tunable Oscillator
- Step-up Voltage Regulation
- Dual Encoder Operation
- 6 Inputs
- Queue Counter
| Parameter
Parameter Name
Value
| Value |
Device Description
KEELOQ® Encoder Devices
|
KEELOQ® Encoder Devices
|
Operating Voltage (V)
2.05 to 5.5
|
2.05 to 5.5
|
Tunable OSC
Yes
|
Yes
|
Function Codes
15
|
15
|
Transmission Code Length Bits
69
|
69
|
Code Hoppings Bits
32
|
32
|
Features
Step-up voltage regulation, Dual Encoder Operation, 6 inputs, Queue counter
|
Step-up voltage regulation, Dual Encoder Operation, 6 inputs, Queue counter
|
|
Documents
RoHS Information
PartNumber | DeviceWeight | ShippingWeight | LeadCount | PackageType | PackageWidth | SolderComposition | JEDECIndicator | RoHS | ChinaEFUP |
---|
HCS370-I/P | 0.953300 | 1.833333 | 14 | PDIP | .300in | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |
HCS370/P | 0.953300 | 1.833333 | 14 | PDIP | .300in | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |
HCS370T-I/SL | 0.143200 | 0.325000 | 14 | SOIC | .150In(3.90mm) | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |
HCS370-I/SL | 0.143200 | 0.280702 | 14 | SOIC | .150In(3.90mm) | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |
HCS370T/SL | 0.143200 | 0.325000 | 14 | SOIC | .150In(3.90mm) | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |
HCS370/SL | 0.143200 | 0.280702 | 14 | SOIC | .150In(3.90mm) | Matte Tin | e3 | ![](/image/microchip/rohs.png) | ![](/image/microchip/china-efup.png) |