PNP general purpose transistor in a SOT883 leadless ultra small plastic package.
NPN complement: 2PC4617M series.
Name/Description | Modified Date |
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PNP general purpose transistor (REV 1.0) PDF (129.0 kB) 2PA1774M_SERIES | 19 Feb 2004 |
Name/Description | Modified Date |
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DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Name/Description | Modified Date |
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Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Name/Description | Modified Date |
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2PA1774SM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SM | 31 Jan 2015 |
2PA1774SM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SM_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | Configuration | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] | fr [min] (MHz) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
2PA1774SM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 430 | 1 | -100 | PNP | -40 | 560 | 270 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
2PA1774SM | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774SM,315 (9340 571 44315) | PC | 2PA1774SM | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |