74AHC374D: Octal D-type flip-flop; positive edge-trigger; 3-state

The 74AHC374; 74AHCT374 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.

The 74AHC374; 74AHCT374 comprises eight D-type flip-flops featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications. A clock input (CP) and an output enable input (OE) are common to all flip-flops.

The eight flip-flops will store the state of their individual D inputs that meet the set-up and hold times requirements for the LOW-to-HIGH CP transition.

When OE is LOW the content of the eight flip-flops is available at the outputs. When OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops.

SOT163-1

Data Sheets (1)

Name/Description	Modified Date
Octal D-type flip-flop; positive edge-trigger; 3-state (REV 3.0) PDF (97.0 kB) 74AHC_AHCT374 [English]	12 Jun 2008

Application Notes (5)

Name/Description	Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]	13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]	13 Mar 2013
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English]	13 Mar 2013
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]	13 Mar 2013
Pin FMEA for AHC/AHCT family (REV 1.0) PDF (52.0 kB) AN11106 [English]	04 Nov 2011

Brochures (2)

Name/Description	Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]	16 Feb 2015
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]	20 May 2014

Package Information (1)

Name/Description	Modified Date
plastic small outline package; 20 leads; body width 7.5 mm (REV 1.0) PDF (335.0 kB) SOT163-1 [English]	08 Feb 2016

Packing (1)

Name/Description	Modified Date
SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (246.0 kB) SOT163-1_118 [English]	15 Apr 2013

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

IBIS Model

ahc374 IBIS model (REV 1.0) ibs AHC374 4/7/2013

Ordering Information

Product	Status	Family	V_CC (V)	Function	Logic switching levels	Description	Package version	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Power dissipation considerations	T_amb (Cel)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name	No of pins
74AHC374D	Active	AHC(T)	2.0 - 5.5	D-type flip-flops	CMOS	positive-edge trigger (3-state)	SOT163-1	+/- 8	4.4	185	low	-40~125	84	27.0	61	SO20	20

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
74AHC374D		SOT163-1	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 13" Q1/T1	Active	74AHC374D,118 (9352 626 80118)	74AHC374D	74AHC374D		week 30, 2004	84.9	6.62	1.51E8	1	1
74AHC374D		SOT163-1		Bulk Pack	Active	74AHC374D,112 (9352 626 80112)	74AHC374D	74AHC374D		week 30, 2004	84.9	6.62	1.51E8	1	1